Esther Wai Ching Yau

Publication Activity (10 Years)

Years Active: 2004-2004
Publications (10 Years): 0

Publications

Esther Wai Ching Yau, Jing Feng Gong, Philip Chan
Al surface morphology effect on flip-chip solder bump shear strength. Microelectron. Reliab. 44 (2) (2004)