Yeong K. Kim

Publication Activity (10 Years)

Years Active: 2004-2017
Publications (10 Years): 2

Top Topics

Computer Based Instruction

Top Venues

Microelectron. Reliab.

Publications

Dong Hyun Park, Sojin Shin, Yeong K. Kim
Module packaging effects on MEMS airbag sensor performance for automobiles. Microelectron. Reliab. 79 (2017)
Yeong K. Kim, Do Soon Hwang
PBGA packaging reliability assessments under random vibrations for space applications. Microelectron. Reliab. 55 (1) (2015)
Yeong K. Kim, Jin Hyuk Gang, Bo-Young Lee
Material property effects on solder failure analyses. Microelectron. Reliab. 51 (5) (2011)
Yeong K. Kim, In Soo Park, Jooho Choi
Warpage mechanism analyses of strip panel type PBGA chip packaging. Microelectron. Reliab. 50 (3) (2010)
Rudolf Krondorfer, Yeong K. Kim, Jaeok Kim, Claes-Gøran Gustafson, Timothy C. Lommasson
Finite element simulation of package stress in transfer molded MEMS pressure sensors. Microelectron. Reliab. 44 (12) (2004)