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Warpage mechanism analyses of strip panel type PBGA chip packaging.
Yeong K. Kim
In Soo Park
Jooho Choi
Published in:
Microelectron. Reliab. (2010)
Keyphrases
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high density
high speed
low cost
neural network
data sets
genetic algorithm
multi agent systems
computational model
multiple types
selection mechanism
physical design
evolvable hardware