Finite element simulation of package stress in transfer molded MEMS pressure sensors.
Rudolf KrondorferYeong K. KimJaeok KimClaes-Gøran GustafsonTimothy C. LommassonPublished in: Microelectron. Reliab. (2004)
Keyphrases
- finite element
- shear stress
- finite element method
- surgical simulation
- boundary element
- finite element model
- finite difference
- computational fluid dynamics
- numerical solution
- mesh generation
- soft tissue
- real time
- finite element analysis
- high fidelity
- dynamic model
- tissue deformation
- sensor networks
- patient specific
- blood flow
- gpu accelerated
- computer assisted
- three dimensional