W.-M. Chen

Publication Activity (10 Years)

Years Active: 2006-2006
Publications (10 Years): 0

Publications

W.-M. Chen, Paul McCloskey, S. Cian O'Mathuna
Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders. Microelectron. Reliab. 46 (5-6) (2006)
D. Noonan, P. J. McNally, W.-M. Chen, A. Lankinen, L. Knuuttila, T. O. Tuomi, A. N. Danilewsky, R. Simon
The evaluation of mechanical stresses developed in underlying silicon substrates due to electroless nickel under bump metallization using synchrotron X-ray topography. Microelectron. J. 37 (11) (2006)