Login / Signup

Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders.

W.-M. ChenPaul McCloskeyS. Cian O'Mathuna
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • mechanical properties
  • composite materials
  • finite element model
  • shear stress
  • neural network
  • material properties
  • motion estimation
  • age estimation