Vithyacharan Retnasamy

Publication Activity (10 Years)

Years Active: 2013-2013
Publications (10 Years): 0

Top Topics

Stress Response

Empirical Evaluation

Top Venues

Asia International Conference on Modelling and Simulation

Publications

Zaliman Sauli, Vithyacharan Retnasamy, Phaklen EhKan, Nor Shakirina Nadzri
Shear Ram Speed Analysis for Gold Wire Bond Shear Test. Asia International Conference on Modelling and Simulation (2013)
Zaliman Sauli, Vithyacharan Retnasamy, Muhamad Hafiz Ab Aziz, Ong Tee Say, Hussin Kamarudin, Dasarathan Rajan Theren, Bahari Man
Shear Height Analysis Study on Sn-3.9Ag-0.6Cu by Using SSF Method. UKSim (2013)
Rajendaran Vairavan, Zaliman Sauli, Vithyacharan Retnasamy, Rizalafande Che Ismail, Nurul Izza Mohd Nor, Nor Shakirina Nadzri, Hussin Kamarudin
High Power LED Thermal and Stress Simulation on Copper Slug. UKSim (2013)
Zaliman Sauli, Vithyacharan Retnasamy, Rajendaran Vairavan, Wan Mokhdzani Wan Nor Haimi, Hussin Kamarudin, Neoh Fung Yih, Nazuhusna Khalid
Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power. UKSim (2013)
Rajendaran Vairavan, Zaliman Sauli, Vithyacharan Retnasamy, Phaklen EhKan, Ong Tee Say
5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED. Asia International Conference on Modelling and Simulation (2013)
Vithyacharan Retnasamy, Zaliman Sauli, Nurul Izza Mohd Nor, Moganraj Palianysamy, Rizalafande Che Ismail, Ong Tee Say, Hussin Kamarudin
Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder. UKSim (2013)
Zaliman Sauli, Vithyacharan Retnasamy, Rajendaran Vairavan, Rizalafande Che Ismail, Nazuhusna Khalid, Mohd Fikri Che Husin, Hussin Kamarudin
Stress and Temperature Simulation Using Copper-Diamond Composite Slug. UKSim (2013)
Zaliman Sauli, Vithyacharan Retnasamy, Ong Tee Say, Steven Taniselass, Rizalafande Che Ismail, Aaron Koay Terr Yeow, Hussin Kamarudin
Shearing Speed Stress Comparison between Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Solder Ball. UKSim (2013)