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Shearing Speed Stress Comparison between Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Solder Ball.

Zaliman SauliVithyacharan RetnasamyOng Tee SaySteven TaniselassRizalafande Che IsmailAaron Koay Terr YeowHussin Kamarudin
Published in: UKSim (2013)
Keyphrases
  • electron microscopy
  • mechanical properties
  • x ray
  • thin film
  • high speed
  • artificial intelligence
  • real time
  • neural network
  • machine learning
  • three dimensional
  • processing speed