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Ong Tee Say
Publication Activity (10 Years)
Years Active: 2013-2013
Publications (10 Years): 0
Top Topics
Evaluation Method
Thin Film
Electron Microscopy
Localization Error
Top Venues
UKSim
Asia International Conference on Modelling and Simulation
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Publications
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Zaliman Sauli
,
Vithyacharan Retnasamy
,
Muhamad Hafiz Ab Aziz
,
Ong Tee Say
,
Hussin Kamarudin
,
Dasarathan Rajan Theren
,
Bahari Man
Shear Height Analysis Study on Sn-3.9Ag-0.6Cu by Using SSF Method.
UKSim
(2013)
Rajendaran Vairavan
,
Zaliman Sauli
,
Vithyacharan Retnasamy
,
Phaklen EhKan
,
Ong Tee Say
5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED.
Asia International Conference on Modelling and Simulation
(2013)
Vithyacharan Retnasamy
,
Zaliman Sauli
,
Nurul Izza Mohd Nor
,
Moganraj Palianysamy
,
Rizalafande Che Ismail
,
Ong Tee Say
,
Hussin Kamarudin
Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder.
UKSim
(2013)
Zaliman Sauli
,
Vithyacharan Retnasamy
,
Ong Tee Say
,
Steven Taniselass
,
Rizalafande Che Ismail
,
Aaron Koay Terr Yeow
,
Hussin Kamarudin
Shearing Speed Stress Comparison between Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Solder Ball.
UKSim
(2013)