Truan-Sheng Lui

Publication Activity (10 Years)

Years Active: 2011-2015
Publications (10 Years): 2

Top Topics

Electrical Properties

Specific Features

High Temperature

Top Venues

Microelectron. Reliab.

Publications

Yi-Wei Tseng, Fei-Yi Hung, Truan-Sheng Lui, Mei-Yu Chen, Hao-Wen Hsueh
Effect of annealing on the microstructure and bonding interface properties of Ag-2Pd alloy wire. Microelectron. Reliab. 55 (8) (2015)
Yi-Wei Tseng, Fei-Yi Hung, Truan-Sheng Lui
Microstructure, tensile and electrical properties of gold-coated silver bonding wire. Microelectron. Reliab. 55 (3-4) (2015)
Hao-Wen Hsueh, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen, Jun-Kai Chang
Microstructure, electric flame-off (EFO) characteristics and tensile properties of silver-lanthanum alloy wire. Microelectron. Reliab. 54 (11) (2014)
Hao-Wen Hsueh, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen
Effect of the direct current on microstructure, tensile property and bonding strength of pure silver wires. Microelectron. Reliab. 53 (8) (2013)
I-Ting Huang, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen, Hao-Wen Hsueh
A study on the tensile fracture mechanism of 15 μm copper wire after EFO process. Microelectron. Reliab. 51 (1) (2011)
Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen, Hao-Wen Hsueh
An investigation into the crystallization and electric flame-off characteristics of 20 μm copper wires. Microelectron. Reliab. 51 (1) (2011)
Hao-Wen Hsueh, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen
Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires. Microelectron. Reliab. 51 (12) (2011)