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Fei-Yi Hung
ORCID
Publication Activity (10 Years)
Years Active: 2011-2015
Publications (10 Years): 2
Top Topics
Finite Element
Specific Features
Electrical Properties
High Temperature
Top Venues
Microelectron. Reliab.
Sensors
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Publications
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Yi-Wei Tseng
,
Fei-Yi Hung
,
Truan-Sheng Lui
,
Mei-Yu Chen
,
Hao-Wen Hsueh
Effect of annealing on the microstructure and bonding interface properties of Ag-2Pd alloy wire.
Microelectron. Reliab.
55 (8) (2015)
Yi-Wei Tseng
,
Fei-Yi Hung
,
Truan-Sheng Lui
Microstructure, tensile and electrical properties of gold-coated silver bonding wire.
Microelectron. Reliab.
55 (3-4) (2015)
Hao-Wen Hsueh
,
Fei-Yi Hung
,
Truan-Sheng Lui
,
Li-Hui Chen
,
Jun-Kai Chang
Microstructure, electric flame-off (EFO) characteristics and tensile properties of silver-lanthanum alloy wire.
Microelectron. Reliab.
54 (11) (2014)
Hao-Wen Hsueh
,
Fei-Yi Hung
,
Truan-Sheng Lui
,
Li-Hui Chen
Effect of the direct current on microstructure, tensile property and bonding strength of pure silver wires.
Microelectron. Reliab.
53 (8) (2013)
Tse-Pu Chen
,
Sheng-Po Chang
,
Fei-Yi Hung
,
Shoou-Jinn Chang
,
Zhan-Shuo Hu
,
Kuan-Jen Chen
Simple Fabrication Process for 2D ZnO Nanowalls and Their Potential Application as a Methane Sensor.
Sensors
13 (3) (2013)
I-Ting Huang
,
Fei-Yi Hung
,
Truan-Sheng Lui
,
Li-Hui Chen
,
Hao-Wen Hsueh
A study on the tensile fracture mechanism of 15 μm copper wire after EFO process.
Microelectron. Reliab.
51 (1) (2011)
Fei-Yi Hung
,
Truan-Sheng Lui
,
Li-Hui Chen
,
Hao-Wen Hsueh
An investigation into the crystallization and electric flame-off characteristics of 20 μm copper wires.
Microelectron. Reliab.
51 (1) (2011)
Hao-Wen Hsueh
,
Fei-Yi Hung
,
Truan-Sheng Lui
,
Li-Hui Chen
Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires.
Microelectron. Reliab.
51 (12) (2011)