Te-yuan Chung

Publication Activity (10 Years)

Years Active: 2012-2015
Publications (10 Years): 0

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Microelectron. Reliab.

Publications

Wei Chih Liu, Yan Hao Chen, Te-yuan Chung, Cheng Yi Liu
Study of Al-Cu compounds as soldering bond pad for high-power device packaging. Microelectron. Reliab. 55 (12) (2015)
Te-yuan Chung, Jian-Hong Jhang, Jing-Sian Chen, Yi-Chien Lo, Gwo-Herng Ho, Mount-Learn Wu, Ching-Cherng Sun
A study of large area die bonding materials and their corresponding mechanical and thermal properties. Microelectron. Reliab. 52 (5) (2012)