Login / Signup

A study of large area die bonding materials and their corresponding mechanical and thermal properties.

Te-yuan ChungJian-Hong JhangJing-Sian ChenYi-Chien LoGwo-Herng HoMount-Learn WuChing-Cherng Sun
Published in: Microelectron. Reliab. (2012)
Keyphrases
  • statistical analysis
  • theoretical framework
  • information technology
  • learning algorithm
  • artificial intelligence
  • multi agent
  • search algorithm
  • probabilistic model
  • experimental study
  • multispectral
  • study proposes