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Cheng Yi Liu
Publication Activity (10 Years)
Years Active: 2015-2015
Publications (10 Years): 0
Top Topics
High Power
Wire Bonding
Top Venues
Microelectron. Reliab.
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Publications
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Wei Chih Liu
,
Yan Hao Chen
,
Te-yuan Chung
,
Cheng Yi Liu
Study of Al-Cu compounds as soldering bond pad for high-power device packaging.
Microelectron. Reliab.
55 (12) (2015)