Shizhu Wen

Publication Activity (10 Years)

Years Active: 2011-2013
Publications (10 Years): 0

Top Topics

Mechanical Properties

Top Venues

Microelectron. Reliab.

Publications

Chenglong Liao, Dan Guo, Shizhu Wen, Xinchun Lu, Jianbin Luo
Stress analysis of Cu/low-k interconnect structure during whole Cu-CMP process using finite element method. Microelectron. Reliab. 53 (5) (2013)
Chao Wan, Zhixiu Hao, Shizhu Wen
The finite element analysis of three grafts in the anterior cruciate ligament reconstruction. BMEI (2011)