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Stress analysis of Cu/low-k interconnect structure during whole Cu-CMP process using finite element method.

Chenglong LiaoDan GuoShizhu WenXinchun LuJianbin Luo
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • finite element method
  • finite element
  • reinforcement learning
  • pairwise
  • evolutionary algorithm
  • higher order
  • high speed
  • subband
  • numerical solution
  • mechanical properties