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Chenglong Liao
Publication Activity (10 Years)
Years Active: 2013-2013
Publications (10 Years): 0
Top Topics
Finite Element
Subband
Mechanical Properties
Pairwise
Top Venues
Microelectron. Reliab.
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Publications
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Chenglong Liao
,
Dan Guo
,
Shizhu Wen
,
Xinchun Lu
,
Jianbin Luo
Stress analysis of Cu/low-k interconnect structure during whole Cu-CMP process using finite element method.
Microelectron. Reliab.
53 (5) (2013)