Kenjiro Nishikawa

Publication Activity (10 Years)

Years Active: 1997-2020
Publications (10 Years): 3

Top Topics

Wireless Sensor

Experimental Verification

Energy Efficiency

Top Venues

IEICE Trans. Electron.

Publications

Satoshi Yoshida, Kenjiro Nishikawa
Experimental Verification of Excavated Structure on Multi-Layered Substrates for Millimeter-Wave Signal Vertical Transition Using Copper Balls. IEEE Access 8 (2020)
Koshi Hamano, Ayako Suzuki, Kenjiro Nishikawa, Shigeo Kawasaki
2.4/5.8GHz Dual-band Rectifiers for Aerospace Wireless Sensor and RF Energy Harvester System. RWS (2019)
Kenjiro Nishikawa
Foreword. IEICE Trans. Electron. (7) (2015)
Ken Hiraga, Tomohiro Seki, Kentaro Nishimori, Kenjiro Nishikawa, Ichihiko Toyoda, Kazuhiro Uehara
Analyses of Antenna Displacement in Short-Range MIMO Transmission over Millimeter-Wave. IEICE Trans. Commun. (10) (2011)
Yo Yamaguchi, Takana Kaho, Motoharu Sasaki, Kenjiro Nishikawa, Tomohiro Seki, Tadao Nakagawa, Kazuhiro Uehara, Kiyomichi Araki
An Analysis of Multi-Layer Inductors for Miniaturizing of GaAs MMIC. IEICE Trans. Electron. (7) (2010)
Naoki Honma, Tomohiro Seki, Kenjiro Nishikawa, Koichi Tsunekawa, Kunio Sawaya
Series-Fed Beam-Scanning Antenna Employing Multi-Stage Configured Microstrip Antennas with Tunable Reactance Devices. IEICE Trans. Commun. (6) (2005)
Kenjiro Nishikawa, Kenji Kamogawa, Belinda Piernas, Masami Tokumitsu, Suehiro Sugitani, Ichihiko Toyoda, Katsuhiko Araki
Three-dimensional MMIC technology for low-cost millimeter-wave MMICs. IEEE J. Solid State Circuits 36 (9) (2001)
Tsuneo Tokumitsu, Makoto Hirano, Kimiyoshi Yamasaki, Chikara Yamaguchi, Kenjiro Nishikawa, Masayoshi Aikawa
Highly integrated three-dimensional MMIC technology applied to novel masterslice GaAs- and Si-MMICs. IEEE J. Solid State Circuits 32 (9) (1997)