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Highly integrated three-dimensional MMIC technology applied to novel masterslice GaAs- and Si-MMICs.

Tsuneo TokumitsuMakoto HiranoKimiyoshi YamasakiChikara YamaguchiKenjiro NishikawaMasayoshi Aikawa
Published in: IEEE J. Solid State Circuits (1997)
Keyphrases
  • three dimensional
  • case study
  • multi agent
  • x ray
  • cost effective
  • rapid development
  • real time
  • machine learning
  • decision making
  • multi view
  • computer systems
  • depth map