Login / Signup

Experimental Verification of Excavated Structure on Multi-Layered Substrates for Millimeter-Wave Signal Vertical Transition Using Copper Balls.

Satoshi YoshidaKenjiro Nishikawa
Published in: IEEE Access (2020)
Keyphrases
  • multi layered
  • experimental verification
  • millimeter wave
  • thin film
  • image processing
  • signal processing