Login / Signup
Ji-guang Han
Publication Activity (10 Years)
Years Active: 2012-2014
Publications (10 Years): 0
Top Topics
Mechanical Properties
High Density
Neural Network
Development Environment
Top Venues
Microelectron. Reliab.
</>
Publications
</>
Liang Zhang
,
Ji-guang Han
,
Yong-huan Guo
,
Cheng-wen He
Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices.
Microelectron. Reliab.
54 (1) (2014)
Liang Zhang
,
Cheng-wen He
,
Yong-huan Guo
,
Ji-guang Han
,
Yong-wei Zhang
,
Xu-yan Wang
Development of SnAg-based lead free solders in electronics packaging.
Microelectron. Reliab.
52 (3) (2012)