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Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices.
Liang Zhang
Ji-guang Han
Yong-huan Guo
Cheng-wen He
Published in:
Microelectron. Reliab. (2014)
Keyphrases
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computational model
probabilistic model
mathematical model
high level
high speed
neural network
objective function
image analysis
prior knowledge
control system
scale space
higher level
theoretical framework
high density
measured data