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Development of SnAg-based lead free solders in electronics packaging.
Liang Zhang
Cheng-wen He
Yong-huan Guo
Ji-guang Han
Yong-wei Zhang
Xu-yan Wang
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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design process
high speed
mechanical properties
neural network
information processing
development process
image sequences
computer science
image restoration
high density
development environment