Login / Signup
Ibrahim Ahmad
ORCID
Publication Activity (10 Years)
Years Active: 2006-2021
Publications (10 Years): 4
Top Topics
Design Principles
Human Computer Interactions
Oil Spill
Computer Games
Top Venues
ICSET
ICCSCE
IVIC
Asia International Conference on Modelling and Simulation
</>
Publications
</>
Mohamed Syazwan Asyraf Bin Rosli
,
Iza Sazanita Isa
,
Mohd Ikmal Fitri Maruzuki
,
Siti Noraini Sulaiman
,
Ibrahim Ahmad
Underwater Animal Detection Using YOLOV4.
ICCSCE
(2021)
Nur Hidayah Adnan
,
Ibrahim Ahmad
,
Norhaida Mohd. Suaib
SCAN-ME: The Development of Augmented Reality Application Prototype using Information, Interface and Interaction Aspect.
ICSET
(2019)
Fatin Aliah Yahya
,
Nazreen Abdullasim
,
Ibrahim Ahmad
The Evaluation of Mobile Educational Game Design Using 3i Factors.
ICSET
(2019)
Ibrahim Ahmad
,
Erman Hamid
,
Nazreen Abdullasim
,
Azizah Jaafar
Game Interface Design: Measuring the Player's Gameplay Experience.
IVIC
(2017)
H. A. Elgomati
,
B. Y. Majlis
,
A. M. Abdul Hamid
,
P. M. Susthitha
,
Ibrahim Ahmad
Modelling of Process Parameters for 32nm PMOS Transistor Using Taguchi Method.
Asia International Conference on Modelling and Simulation
(2012)
Ibrahim Ahmad
,
Azizah Jaafar
Game Design Framework: A Pilot Study on Users' Perceptions.
IVIC (2)
(2011)
Fauziyah Salehuddin
,
Ibrahim Ahmad
,
Fazrena Azlee Hamid
,
Azami Zaharim
Impact of HALO structure on threshold voltage and leakage current in 45nm NMOS device.
APCCAS
(2010)
Nowshad Amin
,
Victor Lim
,
Foong Chee Seng
,
Rozaidi Razid
,
Ibrahim Ahmad
A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages.
Microelectron. Reliab.
49 (5) (2009)
Azrul Azlan Hamzah
,
Yusnira Husaini
,
Burhanuddin Yeop Majlis
,
Ibrahim Ahmad
Selection of High Strength Encapsulant for MEMS Devices Undergoing High Pressure Packaging
CoRR
(2008)
Mohd Khairuddin Md Arshad
,
Azman Jalar
,
Ibrahim Ahmad
Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process.
Microelectron. Reliab.
47 (7) (2007)
Hoh Huey Jiun
,
Ibrahim Ahmad
,
Azman Jalar
,
Ghazali Omar
Effect of wafer thinning methods towards fracture strength and topography of silicon die.
Microelectron. Reliab.
46 (5-6) (2006)
Mohd Khairuddin Md Arshad
,
Ibrahim Ahmad
,
Azman Jalar
,
Ghazali Omar
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition.
Microelectron. Reliab.
46 (2-4) (2006)