Hirohiko Endoh

Publication Activity (10 Years)

Years Active: 2013-2015
Publications (10 Years): 0

Top Topics

Multiresolution

Top Venues

Microelectron. Reliab.

Publications

Hirohiko Endoh, Takuya Naoe
Copper wire bonding package decapsulation using the anodic protection method. Microelectron. Reliab. 55 (1) (2015)
Takuya Naoe, Tamao Ikeuchi, Chie Moritni, Hirohiko Endoh, Kohichi Yokoyama
Local damage free Si substrate ultra thinning for backside emission spectral analysis using OBPF for LSI failure mode detection. Microelectron. Reliab. 53 (12) (2013)