Franz Schrank

Publication Activity (10 Years)

Years Active: 2010-2018
Publications (10 Years): 6

Top Topics

Cmos Technology

Defect Detection

Power Dissipation

Top Venues

Microelectron. Reliab.

Publications

Lisa Mitterhuber, Stefan Defregger, Julien Magnien, Jördis Rosc, René Hammer, Lena Goullon, Matthias Hutter, Franz Schrank, Stefan Hörth, Elke Kraker
Thermal transient measurement and modelling of a power cycled flip-chip LED module. Microelectron. Reliab. 81 (2018)
Eva Kozic, René Hammer, Jördis Rosc, Bernhard Sartory, Joerg Siegert, Franz Schrank, Roland Brunner
Metallization defect detection in 3D integrated components using scanning acoustic microscopy and acoustic simulations. Microelectron. Reliab. (2018)
Julien Magnien, Lisa Mitterhuber, Jördis Rosc, Franz Schrank, Stefan Hörth, Matthias Hutter, Stefan Defregger, Elke Kraker
Parameter driven monitoring for a flip-chip LED module under power cycling condition. Microelectron. Reliab. 82 (2018)
Lisa Mitterhuber, Stefan Defregger, René Hammer, Julien Magnien, Franz Schrank, Stefan Hörth, Matthias Hutter, Elke Kraker
Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation. Microelectron. Reliab. 79 (2017)
Julien Magnien, Lisa Mitterhuber, Jördis Rosc, Franz Schrank, Stefan Hörth, Lena Goullon, Matthias Hutter, Stefan Defregger, Elke Kraker
Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. Microelectron. Reliab. (2017)
E. Grünwald, Jördis Rosc, René Hammer, P. Czurratis, M. Koch, Jochen Kraft, Franz Schrank, Roland Brunner
Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy. Microelectron. Reliab. 64 (2016)
Giorgio C. Mutinati, Elise Brunet, Olena Yurchenko, Elmar Laubender, Gerald A. Urban, Anton Köck, Stephan Steinhauer, Joerg Siegert, Karl Rohracher, Franz Schrank, Martin Schrems
Bimetallic nanoparticles for optimizing CMOS integrated SnO2 gas sensor devices. ESSDERC (2014)
Martin Schrems, Joerg Siegert, Peter Dorfi, Jochen Kraft, Ewald Stueckler, Franz Schrank, Siegfried Selberherr
Manufacturing of 3D integrated sensors and circuits. ESSDERC (2014)
Martin Siegele, Christoph Gamauf, Alexander Nemecek, Giorgio C. Mutinati, Stephan Steinhauer, Anton Köck, Jochen Kraft, Jorg Siezert, Franz Schrank
Optimized integrated micro-hotplates in CMOS technology. NEWCAS (2013)
C. Cassidy, J. Teva, Jochen Kraft, Franz Schrank
Through Silicon Via (TSV) defect investigations using lateral emission microscopy. Microelectron. Reliab. 50 (9-11) (2010)