Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation.
Lisa MitterhuberStefan DefreggerRené HammerJulien MagnienFranz SchrankStefan HörthMatthias HutterElke KrakerPublished in: Microelectron. Reliab. (2017)
Keyphrases
- heat transfer
- temperature field
- heat flow
- low cost
- discrete event simulation
- numerical simulations
- thermal conductivity
- high speed
- mathematical models
- host computer
- simulation model
- simulation environment
- computational fluid dynamics
- neural network
- design methodology
- diffusion process
- single chip
- finite element method
- heat exchanger
- chip design