Daquan Yu

Publication Activity (10 Years)

Years Active: 2012-2024
Publications (10 Years): 7

Top Topics

Cmos Image Sensor

Magnetic Recording

Top Venues

Microelectron. J.

Microelectron. Reliab.

Publications

Chen Yu, Shaocheng Wu, Yi Zhong, Rongbin Xu, Tian Yu, Jin Zhao, Daquan Yu
Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging. Sensors 24 (1) (2024)
Zuohuan Chen, Daquan Yu, Yi Zhong
Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter. Sensors 22 (6) (2022)
Zuohuan Chen, Daquan Yu
Development of a Reliable High-Performance WLP for a SAW Device. Sensors 22 (15) (2022)
Dongfang Pan, Guolong Li, Fangting Miao, Biao Deng, Junying Wei, Daquan Yu, Ming Liu, Lin Cheng
A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density. ISSCC (2021)
Xiaoli Ren, Junying Wei, Daquan Yu
Design and Fabrication of High Density 3D IPDs (Integrated Passive Devices) on Glass Substrate. ICTA (2020)
Tianshen Zhou, Shuying Ma, Daquan Yu, Ming Li, Tao Hang
Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application. Sensors 20 (15) (2020)
Jie Pan, Huijuan Wang, Gengxin Tian, Liqiang Cao, Daquan Yu
Design of a compact silicon-based integrated passive band-pass filter with two tunable finite transmission zeros. Microelectron. J. 49 (2016)
He Ma, Daquan Yu, Jun Wang
The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer. Microelectron. Reliab. 54 (2) (2014)
Daquan Yu
Development of reliable low temperature wafer level hermetic bonding using composite seal joint. Microelectron. Reliab. 52 (3) (2012)