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A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density.

Dongfang PanGuolong LiFangting MiaoBiao DengJunying WeiDaquan YuMing LiuLin Cheng
Published in: ISSCC (2021)
Keyphrases
  • dc dc converter
  • power consumption
  • power supply
  • control method
  • multiple output
  • multichip module
  • power distribution
  • fuzzy logic
  • transient response
  • control strategy
  • high density