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Da-Yuan Shih
Publication Activity (10 Years)
Years Active: 2005-2009
Publications (10 Years): 0
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Publications
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Sun-Kyoung Seo
,
Sung K. Kang
,
Da-Yuan Shih
,
Hyuck Mo Lee
The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging.
Microelectron. Reliab.
49 (3) (2009)
Peter A. Gruber
,
Luc Bélanger
,
Guy P. Brouillette
,
David H. Danovitch
,
Jean-Luc Landreville
,
David T. Naugle
,
Valerie A. Oberson
,
Da-Yuan Shih
,
Chris L. Tessler
,
Michel R. Turgeon
Low-cost wafer bumping.
IBM J. Res. Dev.
49 (4-5) (2005)
Sung K. Kang
,
Paul Lauro
,
Da-Yuan Shih
,
Donald W. Henderson
,
Karl J. Puttlitz
Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications.
IBM J. Res. Dev.
49 (4-5) (2005)