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Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications.

Sung K. KangPaul LauroDa-Yuan ShihDonald W. HendersonKarl J. Puttlitz
Published in: IBM J. Res. Dev. (2005)
Keyphrases
  • mechanical properties
  • composite materials
  • finite element model
  • thin film
  • genetic algorithm
  • stainless steel