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Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications.
Sung K. Kang
Paul Lauro
Da-Yuan Shih
Donald W. Henderson
Karl J. Puttlitz
Published in:
IBM J. Res. Dev. (2005)
Keyphrases
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mechanical properties
composite materials
finite element model
thin film
genetic algorithm
stainless steel