Low-cost wafer bumping.

Peter A. Gruber Luc Bélanger Guy P. Brouillette David H. Danovitch Jean-Luc Landreville David T. Naugle Valerie A. Oberson Da-Yuan Shih Chris L. Tessler Michel R. Turgeon

Published in: IBM J. Res. Dev. (2005)

Keyphrases

low cost
integrated circuit
hardware and software
semiconductor manufacturing
low power
cost effective
massively parallel
real time
digital camera
data acquisition
neural network
single chip
database
control system
expert systems
high speed
multi agent
bayesian networks
highly efficient
machine learning