Login / Signup
The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging.
Sun-Kyoung Seo
Sung K. Kang
Da-Yuan Shih
Hyuck Mo Lee
Published in:
Microelectron. Reliab. (2009)
Keyphrases
</>
mechanical properties
high temperature
finite element model
electron microscopy
image registration
diesel engine