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Classe Francis
Publication Activity (10 Years)
Years Active: 2014-2014
Publications (10 Years): 0
Top Topics
Wire Bonding
Bond Pad
Theoretical Analysis
Online Environment
Top Venues
Microelectron. Reliab.
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Publications
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Chong Leong Gan
,
Classe Francis
,
Bak Lee Chan
,
Uda Hashim
Copper Wire Bonding, Preeti S., Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht, Springer (2014). XXVI, pp 235, ISBN: 978-1-4614-5760-2 (Print), 978-1-4614-5761-9 (Online).
Microelectron. Reliab.
54 (2) (2014)