Chong Leong Gan

Publication Activity (10 Years)

Years Active: 2014-2017
Publications (10 Years): 5

Top Topics

Heterogeneous Systems

Design Requirements

Resistive Ribbon

Computer Science

Top Venues

Microelectron. Reliab.

Publications

Chong Leong Gan, Mohamad Zainudeen Moideen
Soft error mechanisms, modeling and mitigation. Springer (2016). Microelectron. Reliab. 74 (2017)
Chong Leong Gan, Mohamad Zainudeen Moideen
Book Review: Carbon Nanotubes for Interconnects: Process, Design and Applications (2017), Springer, ISBN: ISBN 978-3-319-29744-6 (Print) ISBN 978-3-319-29746-0 (Online). Microelectron. Reliab. 70 (2017)
Chong Leong Gan, Uda Hashim
3D Stacked Chips: from Emerging Processes to Heterogeneous Systems. Springer (2016), ISBN: 978-3-319-20481-9. Microelectron. Reliab. 63 (2016)
Chong Leong Gan, Uda Hashim
3D Flash Memories. Microelectron. Reliab. 65 (2016)
Chong Leong Gan
Book Review: Fundamentals of Bias Temperature Instability in MOS Transistors. Springer (2016). Microelectron. Reliab. 59 (2016)
Chong Leong Gan, Uda Hashim
Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability). Springer (2015). XIII pp. 253, ISBN: 978-1-4614-9265-8 (Print), 978-1-4614-9266-5 (Online). Microelectron. Reliab. 55 (5) (2015)
Chong Leong Gan, Uda Hashim
Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging), XVII. Springer (2015), 322, ISBN: 978-1-4939-1555-2. Microelectron. Reliab. 55 (11) (2015)
Chong Leong Gan, Classe Francis, Bak Lee Chan, Uda Hashim
Copper Wire Bonding, Preeti S., Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht, Springer (2014). XXVI, pp 235, ISBN: 978-1-4614-5760-2 (Print), 978-1-4614-5761-9 (Online). Microelectron. Reliab. 54 (2) (2014)