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Copper Wire Bonding, Preeti S., Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht, Springer (2014). XXVI, pp 235, ISBN: 978-1-4614-5760-2 (Print), 978-1-4614-5761-9 (Online).

Chong Leong GanClasse FrancisBak Lee ChanUda Hashim
Published in: Microelectron. Reliab. (2014)
Keyphrases
  • wire bonding
  • online learning
  • bond pad
  • stress response
  • computer science
  • real time
  • international symposium
  • information retrieval
  • theoretical analysis
  • experimental data
  • online environment