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Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging), XVII. Springer (2015), 322, ISBN: 978-1-4939-1555-2.
Chong Leong Gan
Uda Hashim
Published in:
Microelectron. Reliab. (2015)
Keyphrases
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high density
high speed
analog vlsi
circuit design
power electronics
low power
integrated circuit
evolutionary algorithm
mathematical model
cmos image sensor