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Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging), XVII. Springer (2015), 322, ISBN: 978-1-4939-1555-2.

Chong Leong GanUda Hashim
Published in: Microelectron. Reliab. (2015)
Keyphrases
  • high density
  • high speed
  • analog vlsi
  • circuit design
  • power electronics
  • low power
  • integrated circuit
  • evolutionary algorithm
  • mathematical model
  • cmos image sensor