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Chin-Sung Chung
Publication Activity (10 Years)
Years Active: 2015-2015
Publications (10 Years): 1
Top Topics
High Impact
Mobile Robot
Mechanical Properties
Electron Microscopy
Top Venues
Microelectron. Reliab.
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Publications
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Van Luong Nguyen
,
Chin-Sung Chung
,
Ho-Kyung Kim
The tensile impact properties of aged Sn-3Ag-0.5Cu/Cu solder joints.
Microelectron. Reliab.
55 (12) (2015)