Login / Signup

The tensile impact properties of aged Sn-3Ag-0.5Cu/Cu solder joints.

Van Luong NguyenChin-Sung ChungHo-Kyung Kim
Published in: Microelectron. Reliab. (2015)
Keyphrases
  • electron microscopy
  • mechanical properties
  • x ray
  • thin film
  • wide range
  • mobile robot
  • finite element
  • structural properties
  • desirable properties
  • object recognition
  • lower bound
  • relational databases
  • high impact