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The tensile impact properties of aged Sn-3Ag-0.5Cu/Cu solder joints.
Van Luong Nguyen
Chin-Sung Chung
Ho-Kyung Kim
Published in:
Microelectron. Reliab. (2015)
Keyphrases
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electron microscopy
mechanical properties
x ray
thin film
wide range
mobile robot
finite element
structural properties
desirable properties
object recognition
lower bound
relational databases
high impact