The tensile impact properties of aged Sn-3Ag-0.5Cu/Cu solder joints.

Van Luong Nguyen Chin-Sung Chung Ho-Kyung Kim

Published in: Microelectron. Reliab. (2015)

Keyphrases

electron microscopy
mechanical properties
x ray
thin film
wide range
mobile robot
finite element
structural properties
desirable properties
object recognition
lower bound
relational databases
high impact