Aaron Buchwald

Publication Activity (10 Years)

Years Active: 1997-2024
Publications (10 Years): 6

Top Topics

Metal Oxide Semiconductor

Application Specific

Top Venues

IEEE Commun. Mag.

Publications

Aaron Buchwald, Stephen Buttolph, Andrew Lewis-Pye, Patrick O'Grady, Kevin Sekniqi
Frosty: Bringing strong liveness guarantees to the Snow family of consensus protocols. CoRR (2024)
Aaron Buchwald
Educational session 1-2: Time interleaved ADCs requirements vs. application. CICC (2018)
Aaron Buchwald
A supposedly clever thing i'll never do again. CICC (2017)
Michael Q. Le, James Gorecki, Jamal Riani, Jorge Pernillo, A. Tan, K. Gopalakrishnan, Belal Helal, Pulkit Khandelwal, Chang-Feng Loi, Irene Quek, P. Wong, Aaron Buchwald
A background calibrated 28GS/s 8b interleaved SAR ADC in 28nm CMOS. CICC (2017)
David Robertson, Aaron Buchwald, Michael Flynn, Hae-Seung Lee, Un-Ku Moon, Boris Murmann
Data converter reflections: 19 papers from the last ten years that deserve a second look. ESSCIRC (2016)
Aaron Buchwald
High-speed time interleaved ADCs. IEEE Commun. Mag. 54 (4) (2016)
Aaron Buchwald
Practical considerations for application specific time interleaved ADCs. CICC (2015)
Fang Lu, Jonathan S. Min, Sam Liu, Kelly Cameron, Christopher Jones, Owen Lee, Johnson Li, Aaron Buchwald, Stephen Jantzi, Christopher Ward, Kenneth Choi, Jim Searle, Henry Samueli
A single-chip universal burst receiver for cable modem/digital cable-TV applications. CICC (2000)
Lionel J. D'Luna, Loke K. Tan, Dean Mueller, Joe L. Laskowski, Kelly Cameron, Jind-Yeh Lee, David Gee, Jason S. Monroe, Honman S. Law, Jason Chang, Myles H. Wakayama, Tom Kwan, Chi-Hung Lin, Aaron Buchwald, Tarek Kaylani, Fang Lu, Tom Spieker, Robert A. Hawley, Henry Samueli
A single-chip universal cable set-top box/modem transceiver. IEEE J. Solid State Circuits 34 (11) (1999)
Klaas Bult, Aaron Buchwald
. IEEE J. Solid State Circuits 32 (11) (1997)