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Fabrication of Optimally Micro-Textured Copper Substrates by Plasma Printing for Plastic Mold Packaging.
Tatsuhiko Aizawa
Yasuo Saito
Hideharu Hasegawa
Kenji Wasa
Published in:
Int. J. Autom. Technol. (2020)
Keyphrases
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high density
thin film
magnetic recording
plasma etching
chemical vapor deposition
low density
high speed
data center
input image
low cost
textured surfaces
room temperature
electro mechanical systems
textured regions
film thickness
textured images
image processing
ink jet
data sets
database