Failure mechanisms of microbolometer thermal imager sensors using chip-scale packaging.
Michael ElßnerHolger VogtPublished in: Microelectron. Reliab. (2015)
Keyphrases
- infrared
- focal plane
- high speed
- image sensor
- high density
- analog vlsi
- multi sensor
- infrared sensors
- real time
- imaging systems
- data fusion
- visible spectrum
- sensor technology
- sensor data
- scale space
- low cost
- sensor networks
- single chip
- low power
- multiscale
- dynamic range
- mechanism design
- sensor fusion
- failure rate
- physical design
- image processing algorithms
- motion blur
- hardware implementation
- high temperature
- hyperspectral
- thermal imaging
- power consumption