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A data-driven method for enhancing the image-based automatic inspection of IC wire bonding defects.
Junlong Chen
Zijun Zhang
Feng Wu
Published in:
Int. J. Prod. Res. (2021)
Keyphrases
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automatic inspection
vision system
wire bonding
stress response
computer vision
integrated circuit
machine vision
image processing
co occurrence
binary images
process control
bond pad