Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV).
Hiroshi YoshikawaAtsuko KawasakiTomoaki IidukaYasushi NishimuraKazumasa TanidaKazutaka AkiyamaMasahiro SekiguchiMie MatsuoSatoru FukuchiKatsutomu TakahashiPublished in: ISSCC (2009)
Keyphrases
- high density
- high speed
- low cost
- rotation and translation
- field of view
- real time
- host computer
- video camera
- single camera
- image sensor
- vision system
- scale space
- analog vlsi
- cmos technology
- multiple cameras
- hand held
- focal plane
- liquid crystal
- charge coupled device
- surveillance system
- camera calibration
- real scenes
- focal length
- camera parameters
- programmable logic
- digital camera
- camera motion
- physical design
- multi camera
- low power
- vlsi implementation