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Thermal-aware test scheduling for NOC-based 3D integrated circuits.

Dong XiangGang LiuKrishnendu ChakrabartyHideo Fujiwara
Published in: VLSI-SoC (2013)
Keyphrases
  • integrated circuit
  • built in self test
  • scheduling problem
  • round robin
  • electron beam
  • scheduling algorithm
  • resource constraints
  • printed circuit boards
  • image processing
  • low cost
  • multi processor