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Role of Through Silicon Via in 3D Integration: Impact on Delay and Power.

Shivangi ChandrakarDeepika GuptaManoj Kumar Majumder
Published in: J. Circuits Syst. Comput. (2021)
Keyphrases
  • low cost
  • power consumption
  • high density
  • data integration
  • high speed
  • information integration
  • power dissipation
  • silicon dioxide