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Built-in self-test/repair scheme for TSV-based three-dimensional integrated circuits.

Hung-Yen HuangYu-Sheng HuangChun-Lung Hsu
Published in: APCCAS (2010)
Keyphrases
  • integrated circuit
  • built in self test
  • three dimensional
  • detection scheme
  • x ray
  • electron beam
  • printed circuit boards
  • recognition scheme
  • medical images
  • representation scheme