Pre-Bond Probing of Through-Silicon Vias in 3-D Stacked ICs.

Brandon Noia Krishnendu Chakrabarty

Published in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2013)

Keyphrases

high density
neural network
low cost
high speed
thin film
post treatment
transmission electron microscopy
data sets
artificial intelligence
information systems
image processing
space charge