Electrical characterization of epoxy-based molding compounds for next generation HV ICs in presence of moisture.
Davide CornigliSusanna ReggianiAntonio GnudiElena GnaniGiorgio BaccaraniD. FabianiD. VargheseEnis TuncerS. KrishnanLuu NguyenPublished in: Microelectron. Reliab. (2018)