High density backside tungsten TSV for 3D stacked ICs.

Reynard Blasa Brian Mattis Dave Martini Sidi Lanee Carl Petteway Sangki Hong Kangsoo Yi

Published in: 3DIC (2016)

Keyphrases

high density
thin film
low density
high power
close proximity
data center
high bandwidth
magnetic recording
data sets
machine learning
steady state
field effect transistors
magnetic tape
plasma etching
markov chain
end to end